PSOP (SOIC w/heatslug)

Small Outline, thermally enhanced with heatsink

The footprints created for each individual package should be used as a reference only. Since these footprints are not part specific you will have to adjust the dimension to best fit your requirements

  • Package
  • Outline
  • Material Information
  • 16 ld SOIC-EP (rd-16-1)
  • pdf
  • pdf
  • 28 ld PSOP (17.90 x 7.5mm) (rp-28)
  • pdf
  •    
  • 20 ld PSOP (rp-20)
  • pdf
  • pdf
  • 24 ld SOIC w/Batwing (rb-24)
  • pdf
  • pdf
  • 8 ld SOIC-EP (2.41mm Exposed pad) (rd-8-2)
  • pdf
  • pdf
  • 8 ld SOIC-EP (rd-8-1)
  • pdf
  • pdf