CSP BGA (Ball Grid Array)
Chip Scale Package BGA, 0.5, 0.65, 0.8, and 1.0mm pitch
The footprints created for each individual package should be used as a reference only. Since these footprints are not part specific you will have to adjust the dimension to best fit your requirements.
- Material Information
- 184 ball CSPBGA (12x12x1.7mm) (BC-184-1)