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Package Designators

Package Codes Included in PCN #02_0011

Package Code Package Name Package Description
CP LFCSP Leadless Chip Scale Package
 
N PDIP Plastic DIP (plating only, will not be +255°C (+ 5/-0°C) compliant)
 
P PLCC Plastic Leaded Chip Carrier, 50 mil Pitch
 
R SOIC Small Line Packages
RM Mini_SO Mini Small Outline Package/Micro-SO
RN or R SOIC_N Small Outline Package - Narrow Body 150 mils
RQ QSOP SOIC with .025 mil pitch
RS SSOP Shrink Small Outline Package
RT SOT_23 SOT-23 (All Leads)
RU TSSOP_4.4 Thin Shrink Small Outline Package, 4.4 mm Body
RV TSSOP_6.1 Thin Shrink Small Outline Package, 6.1 mm Body
RW SOIC_W Small Outline Package - Wide Body 300 mils
RB SOIC_W_BAT Small Outline Package with Thermal "Batwing" Leads - Wide Body 300 mils
 
S MQFP Metric Plastic Quad Flatpack, PQFP 2.0-3.5 mm
ST LQFP Low Profile Plastic Quad Flatpack, PQFP 1.4 mm
SU TQFP Thin Plastic Quad Flatpack, PQFP 1.0 mm

SP (Power PQFP with Heat Slug), SQ (Power Thin PQFP 1.4 mm), and SV (Ultra Thin Power PQFP 1.0 mm)
packages are not included in the PCN and will be covered in a separate PCN.

A few legacy products have the following codes PDIP - P and SOIC - S.

Package Codes Included in PCN #04_0065

Package Code Package Name Package Description
BC CSP_BGA Chip Scale Package BGA
B BGA Plastic Ball Grid Array
BP BGA_ED Ball Grid Array Thermally Enhanced w/heat sink (SBGA, EBGA, Super FC BGA)
 
CC LGA Chip Array Small outline No Lead Package (Cason, LGA)
 
P PLCC Plastic Leaded Chip Carrier, 50 mil pitch
 
ST LQFP Low Profile Plastic Quad Flat Pack, 1.4 mm Body Thickness
S MQFP Metric Plastic Quad Flat Pack, 2.0-3.5 mm Body Thickness
SQ LQFP_ED Edquad Low Profile Quad Flat Package Thermally Enhanced w/heat sink
SP MQFP_ED Edquad Metric Quad Flat Package Thermally Enhanced w/heat sink
 
PP PLCC_ED_C Edquad with Ceramic Plastic Leaded Chip Carrier Thermally Enhanced w/heat sink
 
SV TQFP_EP Exposed Paddle Thin Quad Flat Packages, 1.0 mm Body Thickness
 
RA SOT_143 Small Outline Transistor Package
RE TSSOP_EP Exposed Pad Think Shrink Small Outline Package, 4.4 mm Body
RC QSOP_EP Exposed Pad Shrink Small Outline Package, 150 mil Body
RD SOIC_N_EP Exposed Pad Small Outline Package, 150 mil Body
RP PSOP_2 Small Outline Thermally Enhanced w/heat sink, 300 mil Body
RR PSOP_3 Small Outline Thermally Enhanced w/heat sink, 11 mm Body
 
T TO-92 Plastic Header Package (flat index)
 
KC SOT_223 Small Outline Transistor Package
KS SC70 Thin Shrink Small Outline Transistor Package

Last Updated 4/04