LEAD (PB) FREE ROHS COMPLIANCE STATUS AND PLANS - ANALOG DEVICES, INC.
REVISION 17 – FEBRUARY 2009

Objective

Satisfy customer and governmental requirements for eliminating Pb from our product in a time frame consistent with the market and well in advance of the Euro "WEEE" and other legislation.

Issues

  1. Materials Set. Re-engineer a material set (molding compound and die attach epoxy) so devices can withstand a +255°C (+5/-0°C) reflow temperature necessary for some Pb free solder paste/ terminal finish systems. The material set has been chosen for maximizing the moisture sensitivity level performance of the devices, ensuring RoHS compliance of the package, and minimally impacting our product cost structure, while progressing at a pace ahead of the industry. Conversion of packages listed in PCN #02_0011 and PCN #04_0065 is complete.

  2. Terminal Finish. Choose terminal finish that does not contain Pb, does not result in degraded device performance or reliability, and meets industry soldering requirements. Given the current needs of our customers, we have decided to offer matte tin (Sn) and gold (Au) Pb Free plating and tin/silver/copper (Sn/Ag/Cu) solder spheres for volume applications. We continue to offer SnPb plating for device types currently available with SnPb finish; however, our suppliers continue to pressure us to migrate away from SnPb plating in favor of Pb Free solutions. RoHS compliant devices with a Pb Free finish are designated with a "Z" suffix in the part number.

  3. Transition. For leadframe based devices, we have not experienced backward compatibility issues as we convert to Pb Free terminal finishes and materials. BGA devices with Pb Free solder spheres are not backward compatible when reflowed at low temperatures. Please refer to the following charts for implications:

Leadframe Parts:

Reflow Profile Package Plating Package Materials Implications
SnPb Profile/
Traditional Solder Paste
SnPb Existing Materials None
SnPb Profile/
Traditional Solder Paste
Sn High Temp Materials Set None
255°C (+5/–0°C)/
Pb Free Solder Paste
SnPb Existing Materials If Bi is in the solder paste, a potential reaction with Pb might cause weak joints. High temperature reflow might cause delamination.
255°C (+5/–0°C)/
Pb Free Solder Paste
Sn High Temp Materials Set None

BGA:

Reflow Profile Ball Composition Package Materials Implications
SnPb Profile/
Traditional Solder Paste
SnPb Existing Materials None
SnPb Profile/
Traditional Solder Paste
SnAgCu High Temp Materials Set Reflow temperature needs to be sufficient to melt solder balls >240°C
255°C (+5/–0°C)/Pb
Free Solder Paste
SnPb Existing Materials High temperature reflow might cause delamination. Solder paste out-gassing into balls might cause voiding.
255°C (+5/–0°C)/
Pb Free Solder Paste
SnAgCu High Temp Materials Set None

Position

A number of FAQ's are on a separate web page within this site. They may be very helpful for providing specific information and are referenced with regard to some of the topics below.

ADI now offers most catalogue device types as RoHS compliant with a Pb Free terminal finish. We continue to add Pb Free RoHS compliant versions as requests for high temperature reflow compatible products come in.

  1. Materials Set. Our high volume plastic packages have completed qualification for high temperature reflow compatibility. These packages are now constructed so they can withstand the +255°C (+5/-0°C) peak reflow temperature. Mechanical samples are available for customers. (See the FAQ sheet for "How do I obtain Pb Free RoHS Compliant Samples?" for more information.) Analog Devices has issued PCN (Process Change Notification) #02_0011 (Original issue: November 2, 2001, Revision 8: May 15, 2004) and PCN #04_0065 (Original issue: April 2004, Revision 6: February 10, 2009) to change to materials compatible with higher peak reflow temperatures. The conversion to the new materials for production of packages included in these PCNs started in February 2002 and is complete.

  2. Terminal Finish. Based on input from our customer base, ADI is offering Pb Free plating (matte Sn and Au) for volume applications. A post Sn plating ("anneal") bake - one hour at 150'C within 24 hours of plating - has been implemented across ADI assembly sites starting with EIA date code 0522 (May 29-June 4, 2005). Implementation has been supported by no change in fit, form, or function of ADI devices and no degradation in solderability.

    SnPb plating is being offered for device types currently available with SnPb finish; however, our suppliers continue to pressure us to migrate away from SnPb plating in favor of Pb Free solutions.

    Sn whisker test data collected to date using JEDEC JESD22A121 test conditions indicates whisker lengths meet the JEDEC JESD201 criteria and class ratings of 2, 1, and 1a. For more information, refer to the Tin Whisker Report available at this site. ADI continues to monitor the progress of industry task forces and the recommendations of other industry organizations and will make any updates through this web site.

    ADI is also selectively adding a Sn3.0Ag0.5Cu solder ball device type for BGA product. Because of concerns about the forward/backward compatibility of SnPb and Sn/Ag/Cu solder spheres under high and low reflow temperatures, we continue to offer SnPb solder spheres as well. We have also qualified SnAgCu solder spheres for WLCSP/Bumped Die products.

  3. Transition. We have developed a detailed plan per a structured TQM methodology that will allow smooth transition to Pb free RoHS compliant devices for our customers.

    Customers have been notified by PCN (Process Change Notification) #02_0011 (Original issue: November 2, 2001, Revision 8 : May 15, 2004) and PCN #04_0065 (Original issue: April 2004, Revision 6: February 10, 2009). These PCNs have provided over 90 days notice as we change material sets to meet a +255°C (+5/-0°C) reflow temperature. These PCNs have also tracked our progress on qualification of our Pb Free RoHS compliant option for a number of packages. Our motivation for issuing the PCNs has been to obtain customer input. We have received valuable input from our customers on the development of our strategy which we greatly appreciate. We look forward to continued customer input.

    We continue to emphasize converting material sets so our high volume plastic leaded products can be used with Pb Free solder paste and a +255°C (+5/-0°C) temperature reflow, whether with an SnPb or Pb Free finish.

    We ask for our customers� cooperation as we work through inventory issues on a few of our device types.

    For most of the catalogue device types that are RoHS compliant and have a Pb Free finish, the device part numbers will contain the letter "Z". (See the FAQ sheet for "Do all Pb Free RoHS compliant parts have a "Z" at the end of the part number?")

    Pb Free RoHS compliance will be marked on the packaging box label. The label types are documented at the "Notification of Label Changes" link at this site. Future changes will also be documented at this site.

    Pb Free RoHS compliant devices will also have a "#" marked on the device to denote Pb Free RoHS compliance, except in cases where there is not room for an additional character such as SOT23, SC70 and TSOT. (See the FAQ sheet for "What is the standard naming convention for Pb Free RoHS compliant parts?" and "How will the parts be marked?") Any device marking changes will be announced via a PCN.

The following packages are now available as Pb Free RoHS compliant.

Package High Temp
Material Set
Qualified Pb Free Finish PCN
CSP BGA Qualified SnAgCu 04_0065
FLATPACK Ceramic Qualified Au 04_0065
HEADER, Metal Qualified Au 04_0065
LCC Qualified Au 04_0065
JLCC Qualified Au 04_0065
LFCSP (9x9 and Below) Qualified Matte Sn 02_0011
LQFP(Body Size 20x20 and Below) Qualified Matte Sn 02_0011
LQFP (Body Size 24x24) Qualified Matte Sn 04_0065
LQFP Integrated Heat Sink
(Body Size 7x7-14x14 ED Quad)
Qualified Matte Sn 04_0065
LQFP Integrated Heat Sink
(Power Quad)
Qualified Matte Sn 04_0065
LQFP Integrated Heat Sink
(INT HS)
Qualified Matte Sn 04_0065
MQFP (Body Size 28x28 and Below) Qualified Matte Sn 02_0011
MQFP (Body Size 32x32) Qualified Matte Sn 04_0065
MQFP Integrated Heat Sink (Power Quad) Qualified Matte Sn 04_0065
Mini SO Qualified Matte Sn 02_0011
PBGA Qualified SnAgCu 04_0065
PDIP Qualified Matte Sn 02_0011
PLCC Qualified Matte Sn 04_0065
PSOP2 Qualified Matte Sn 04_0065
PSOP3 Qualified Matte Sn 04_0065
QSOP Qualified Matte Sn 02_0011
QSOP Exposed Pad Qualified Matte Sn 04_0065
SBDIP Ceramic Sidebrazed Qualified Au 04_0065
SBGA Qualified Matte Sn 04_0065
SC70 Qualified Matte Sn 04_0065
SOIC Qualified Matte Sn 02_0011
SOIC Exposed Pad Qualified Matte Sn 04_0065
SOT-143 Qualified Matte Sn 04_0065
SOT-223 Qualified Matte Sn 04_0065
SOT-23 Qualified Matte Sn 02_0011
SSOP Qualified Matte Sn 02_0011
TO-92 Qualified Matte Sn 04_0065
TQFP Qualified Matte Sn 02_0011
TQFP Exposed Pad Qualified Matte Sn 04_0065
TSSOP Qualified Matte Sn 02_0011
TSSOP Exposed Pad Qualified Matte Sn 04_0065
TSOT Qualified Matte Sn 04_0065
WLCSP/Bumped Die Qualified SnAgCu 04_0065
"Qualified" means the higher volume lead counts within a package family are qualified.
Some packages are Qualified per the exemptions in the EU RoHS regulation. These exemptions include Pb in glass, 85+% high Pb solder in die attach material or solder bump, and Pb in solder forming the interconnection between the die and substrate in flip chip packages. Prior to March 1,2007, these exempted products were labeled as "Pb Free" and/or "RoHS Compliant". Since March 1, 2007, these exempted products are labeled "RoHS Exempt".
A "Solder Joint Reliability" report is available on request.

We will continue to update our Customers and Sales Force through this web site. Customer comments and questions on our "Lead Free RoHS Compliance Program" are welcome and should be directed to:

ADI Quality Group:
World Wide Manufacturing, Analog Devices
804 Woburn St.
M/S 615
Wilmington, MA 01887
Fax: 781-461-4447

Rev. 17 - 02/10/09

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