1. What is ADI's definition of Pb Free RoHS compatible?
ADI defines Pb Free RoHS compatible to mean Pb, Hg, Cd, Cr(+6), PBB, and PBDE are not intentionally added during the manufacturing process and have upper concentration limits as defined below. In addition, Pb Free RoHS compatible indicates the packages are high temperature (255 +5/-0 deg C) compatible.
|RoHS Banned Substance||CAS Number||Upper Concentration Limit|
|Hg (Mercury)||7439-92-1||1000 ppm|
|Pb (Lead)||7439-97-6||1000 ppm|
|Cd (Cadmium)||7440-43-9||5 ppm|
|Cr(+6) (Hexavalent Chromium)||18540-29-9||1000 ppm|
|PBB (Polybrominated Biphenyl)||-||1000 ppm|
|PBDE (Polybrominated Diethyl Ether||-||1000 ppm|
ADI has performed independent lab testing on materials to confirm RoHS compatibility. Test results for the six banned substances are included in our materials declarations, available on the Packages Index page.
Many of ADI packing and shipping materials are also RoHS compatible as has been verified by independent lab testing. Some of our materials are currently being tested for RoHS compatibility, and the status will be available in a future update.
2. Why are we offering Pb Free RoHS compatible parts?
Due to environmental concerns, the need for Pb Free RoHS compatible solutions in electronics components and systems is getting much attention within the semiconductor and electronics industries. Through a combination of regulatory and competitive pressures, we believe our customers will require Pb Free RoHS compatible parts over the next year, and the industry as a whole will ultimately switch to predominantly Pb Free RoHS compatible solutions.
3. What is ADI's current Pb Free RoHS compatible solution?
ADI's current standard finish on the majority of its plastic encapsulated parts is a combination of either Tin and Lead (SnPb) or Tin, Lead, and Silver (SnPbAg). In this regard, we are no different to the vast majority of other device manufacturers. In order to remove the lead (Pb) and offer a Pb Free RoHS compatible parts, there are a number of different terminal finishes that can be considered, each of which has pros and cons. ADI has selected matte Tin (Sn) plating with a post plating bake and Tin Silver Copper (SnAgCu) solder spheres as its Pb Free RoHS compatible finishes.
While we can supply components that are Pb Free and RoHS compatible, in order to make printed circuit boards that are fully Pb Free, electronics board manufacturers must also remove the Pb from the solder pastes that are used to solder components to the printed circuit boards. To do this, they must use solder pastes that have higher reflow temperatures than those used today. We must therefore supply components that can withstand these higher reflow temperatures. ADI has already qualified and converted the majority of its plastic encapsulated components to materials that can withstand these higher temperatures. (See question 12 below.)
4. Can I get Pb Free RoHS compatible samples?
Samples of Pb Free RoHS compatible packages that have internally shorted leads, i.e. "daisy chains" (see SOT 143 example below), are available for several leadframe packages. Customers who require samples should contact ADI Sales Office who will then contact our Pb Free representative in Assembly Engineering.
The "daisy chain" samples can be useful for solder joint continuity testing at the board level. While daisy chained devices can be supplied quickly, for some device types there could be significant lead times for actual product or laminate package samples with Pb Free finish.
5. What is the standard naming convention for Pb Free RoHS compatible parts?
We have established a standard naming convention for parts offered as Pb Free RoHS compatible. We will use the letter "Z" as a suffix to the existing part number. Note the Z suffix appears at the end of the part name i.e. generally after the character that denotes the package style.
|Standard Part Name||Pb-free Part Name|
6. Do all Pb Free RoHS compatible parts have a "Z" at the end of the part number?
No. Certain parts have already been introduced to the market as Pb Free RoHS compatible only, i.e. we do not offer a standard SnPb or SnPbAg finish on these parts. These part numbers do not carry a "Z" suffix, nonetheless these part numbers clearly state the finish on the data sheet and web product pages, and the branding on the parts will clearly indicate that the part is Pb Free RoHS compatible. (See question 7 below). The reasons we are not changing these parts numbers to include the Z are (a) the parts are already introduced and to change the naming would cause problems with customers and with current backlog, and (b) ultimately we hope to convert all parts to a Pb Free RoHS compatible only terminal finish and thus, in the end state, the Z will be a redundant character.
7. What about parts that already use the letter Z as a package designator?
This does present a small problem, but we believe it is manageable. We offer certain parts today that use the letter "Z" as a package designator for a few CERDIP devices introduced before the mid-nineties. Examples are REF430033Z, or OP77EZ. Most ADI products use a "Q" for CERDIP packages. Currently, we have no plans to offer CERDIP parts in Pb-free so it is unlikely that the Z in this case will cause confusion.
8. Which parts are ready to be converted?
Most devices types in the high volume plastic packages (SOIC, LQFP, MQFP, TQFP, SOT, SSOP, TSSOP, MiniSO, QSOP and LFCSP) are offered in high peak temperature reflow materials. Exceptions are currently some stress sensitive devices, power QFP, LQFP 24X24 and larger, MQFP larger than 32x32, and select PLCC and BGA packages. Many of these exceptions are in the process of being qualified for 2005 conversion. Refer to PCN # 02_0011 and PCN # 04_0065 (located at this Pb Free RoHS compatible website) for package conversion status.
9. What about additional package types?
We have recently qualified some additional package types including laminate CSP BGA, SC70, MQFP 32x32, and SOT223. Conversion of other package types will be made during this year based in part on continued customer input.
10. What is the marking convention for Pb Free RoHS compatible devices?
Pb Free RoHS compatible devices will have a "#" marked on the top or bottom of the package to denote compatibility. Several of the packages (SOT23, SC70 and TSOT) are too small to accommodate an additional character, and as a result, there will be no "#" marking on the device. For these small packages, a unique brand code is used for most products to denote the Pb Free RoHS compatible device. Over the next several months, ADI will review capability of marking per JESD97 industry standard. If feasible, we will adopt this standard marking in place of the "#" as our Pb Free RoHS compatible marking.
11. What identification is there on the shipping container for Pb Free RoHS compatible devices?
A Pb Free symbol ("Pb" in a circle with a line through it) and "Pb free RoHS Compliant" has been added to the current label for Pb Free RoHS compatible parts. An example of a typical label is below.
12. Has ADI created all possible Pb Free RoHS compatible parts in the order system?
To provide visibility on ADI plans, we have created all models that intend to be offered as Pb Free RoHS compatible in our enterprise order management system. These part numbers are visible to customers via the WWW ordering guide. Some models may appear as "pre-released", as we are in the process of completing the manufacturing instructions for some of these parts. We expect that all planned Pb Free RoHS compatible models (which are counterparts to already released models containing Pb) will be available for manufacturing and sale by the end of December 2005.
A request-based process is still available for customers that do not see a Pb Free RoHS compatible counterpart model in ADI's system. Customers should contact Local Sales or Distributors with these requests. ADI Customer Service will then be contacted to initiate the request which will be routed to the responsible functions and persons for appropriate actions.
13. What package types are eligible as Pb Free RoHS compatibile?
Several package types are eligible as Pb Free RoHS compatible. Refer to PCN # 02_0011 and PCN # 04_0065 (located at this web site) for package types and their status.
For non-military applications, ADI is considering a plan to offer hermetic package types (ceramic LCC, ceramic sidebrazed DIP, ceramic flatpack, and TO metal can) as Pb Free RoHS compatible. Future updates will be provided on the status of these package types.
14. What temperature profile should be used in soldering parts?
ADI advises reflow profiles should conform to J-STD 20 from JEDEC. Refer to the link below for latest revision (located under "Free Standards").
15. Does ADI's Pb Free RoHS compatible product contain pentabromodiphenylether or octabromodiphenylether?
No, ADI products do not contain pentabromodiphenylether or octabromodiphenylether.
16. Does ADI have materials declarations for component packages?
Materials declarations for several component packages are available on the Packages Index page.
Each declaration is reported by package type, package body size, and pin count. Declarations are 2-page documents with one page corresponding to the Pb Free RoHS compatible package and one page for the Pb-bearing package.
17. Is a post matte tin plating bake implemented on ADI Pb Free RoHS compatible products?
Yes, as of EIA date code 0522 (ADI WW531), 100% of ADI's matte tin plated products undergo a post tin plating bake for 1 hour at 150'C within 24 hours of plating. This post plating bake is also referred to as "annealing." The implementation began with EIA date code 0518 (ADI WW527) and completed during EIA date code 0522 (ADI WW531).
18. Does ADI have matte tin whisker data?
ADI has been in production with matte Sn lead finish for several years with excellent quality and reliability. Sn whisker report is available at Tin Whisker Summary