SOIC(宽体)

Small Outline, 300 mil body, 50 mil pitch. Note: For
SOIC packages when pin 1 dot or notch is absent,
use bevelled edge to identify location

SOIC-W Image

The footprints created for each individual package should be used as a reference only. Since these footprints are not part specific you will have to adjust the dimension to best fit your requirements

  • Package
  • Outline
  • Material Information
  • 20 ld SOIC - Wide (rw-20)
  • pdf
  • pdf
  • 14 ld SOIC - Wide (rw-14)
  • pdf
  • pdf
  • 16 ld SOIC (increased Creepage) (ri-16-2)
  • pdf
  • pdf
  • 18 ld SOIC - Wide (rw-18)
  • pdf
  • pdf
  • 28 ld SOIC - Wide (rw-28)
  • pdf
  • pdf
  • 20 ld SOIC (increased Creepage) (ri-20-1)
  • pdf
  • pdf
  • 16 ld SOIC (increased Creepage) (ri-16-1)
  • pdf
  • pdf
  • 24 ld SOIC - Wide (rw-24)
  • pdf
  • pdf
  • 16 ld SOIC - Wide (rw-16)
  • pdf
  • pdf