PSOP(SOIC带散热块)

Small Outline, thermally enhanced with heatsink

The footprints created for each individual package should be used as a reference only. Since these footprints are not part specific you will have to adjust the dimension to best fit your requirements

Filter packages by entering lead count or product description into the search box below:

Package Outline Material Information
24 ld SOIC w/Batwing (rb-24) pdf pdf
16 ld SOIC-EP (rd-16-1) pdf pdf
8 ld SOIC-EP (rd-8-1) pdf pdf
8 ld SOIC-EP (2.41mm Exposed pad) (rd-8-2) pdf PDF
20 ld PSOP (rp-20) pdf pdf
28 ld PSOP (17.90 x 7.5mm) (rp-28) pdf