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Packages
BGA (Ball Grid Array)
CBGA (Ceramic)
FCBGA
PBGA (Plastic)
SBGA (w/Heatsink)
CSP (Chip Scale Package)
CSP BGA (Ball Grid Array)
LFCSP (LeadFrame)
LGA (Land Grid Array)
Tape CSP BGA
WLCSP (Wafer Level)
DIP (Dual Inline Package)
CerDIP (Ceramic)
CerDIP - Side or Bottom Brazed
CerPAK - Gullwing Leads
Metal or Hybrid DIP
PDIP (Plastic)
FlatPack
Ceramic Flat Package
Header
Modules
TO-92 (Plastic Header)
TO-XX (Metal Header)
LCC (Leaded or Leadless Chip Carrier)
CLCC - Gullwing Leads
J leaded CLCC
LCC (Leadless Ceramic)
LDCC (Leaded Ceramic)
PLCC (Plastic, Leaded)
PLCC w/heat sink
PGA (Pin Grid Array)
Ceramic Pin Grid Array
QFP (Quad Flat Pack)
CQFP (Ceramic)
LQFP 1.4mm thick
LQFP w/heat sink
MQFP
MQFP - Thermally Enhanced
TQFP (Thin, 1.0mm)
TQFP - Thermally Enhanced
SIP (Single Inline Package)
SIP Gullwing Leads
SIP Horizontal Leads
SIP Vertical Leads
SOIC (Small Outline IC)
PSOP (SOIC w/heatslug)
SOIC (Narrow)
SOIC (Wide)
SOP (Small Outline Package)
MSOP (micro-SOIC)
QSOP (25mil pitch)
SSOP (Shrink SO)
Thermally Enhanced [PSOP/2]
TSSOP (Thin, 1.2mm)
TSSOP_EP
SOT (Small Outline Transistor)
SC-70
SOT-143
SOT-223
SOT-23
SOT-66
SOT-89
TSOT-23 (Thin, 0.9mm)
 

For moisture sensitivity information please refer to the material declaration page.
For further assistance please contact 1-800-ANALOGD.

Tape & Reel Devices (pdf, 81,485 bytes)

Tube & Tray Device Counts (pdf, 58,120 bytes)

Thermal Characteristics (pdf, 55,113 bytes)

MicroCSP Wafer Level Chip Scale Package Application Note (AN-617) (pdf, 993,524 bytes)

Lead Frame Chip Scale Package Application Note (AN-772) (pdf, 450,560 bytes)